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High Cell Density Mosfet Power Transistor For Small Motor Control

    Buy cheap High Cell Density Mosfet Power Transistor For Small Motor Control from wholesalers
     
    Buy cheap High Cell Density Mosfet Power Transistor For Small Motor Control from wholesalers
    • Buy cheap High Cell Density Mosfet Power Transistor For Small Motor Control from wholesalers
    • Buy cheap High Cell Density Mosfet Power Transistor For Small Motor Control from wholesalers

    High Cell Density Mosfet Power Transistor For Small Motor Control

    Ask Lasest Price
    Brand Name : Hua Xuan Yang
    Model Number : AP8205A
    Certification : RoHS、SGS
    Price : Negotiated
    Payment Terms : L/C T/T Western Union
    Supply Ability : 18,000,000PCS / Per Day
    Delivery Time : 1 - 2 Weeks
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    High Cell Density Mosfet Power Transistor For Small Motor Control

    High Cell Density Mosfet Power Transistor For Small Motor Control


    Mosfet Power Transistor Description:


    The AP8205A is the highest performance trench
    N-ch MOSFETs with extreme high cell density,
    which provide excellent RDSON and gate charge
    for most of the small power switching and
    load switch applications. The meet the RoHS and
    Product requirement with full function reliability approved.


    Mosfet Power Transistor Features


    VDS = 20V ID = 6A
    RDS(ON) < 27mΩ @ VGS=4.5V
    RDS(ON) <37mΩ @ VGS=2.5V


    Mosfet Power Transistor Application


    Battery protection
    Uninterruptible power supply


    Package Marking and Ordering Information


    Product IDPackMarkingQty(PCS)
    AP8205ATSSOP-88205A5000

    Absolute Maximum Ratings (TA=25unless otherwise noted)


    ParameterSymbolLimitUnit
    Drain-Source VoltageVDS20V
    Gate-Source VoltageVGS±12V
    Drain Current-ContinuousID6A
    Drain Current-Pulsed (Note 1)IDM25A
    Maximum Power DissipationPD1.5W
    Operating Junction and Storage Temperature RangeTJ,TSTG-55 To 150
    Thermal Resistance,Junction-to-Ambient (Note 2)RθJA83℃/W

    Electrical Characteristics (TA=25unless otherwise noted)


    ParameterSymbolConditionMinTypMaxUnit
    Drain-Source Breakdown VoltageBVDSSVGS=0V ID=250μA2021-V
    Zero Gate Voltage Drain CurrentIDSSVDS=19.5V,V GS=0V--1μA
    Gate-Body Leakage CurrentIGSSVGS=±10V,VDS=0V--±100nA
    Gate Threshold VoltageVGS(th)VDS=VGS,ID=250μA0.50.71.2V

    Drain-Source On-State Resistance


    RDS(ON)

    VGS=4.5V, ID=4.5A-2127mΩ
    VGS=2.5V, ID=3.5A-2737mΩ
    Forward TransconductancegFSVDS=5V,ID=4.5A-10-S
    Input CapacitanceClss-600-PF
    Output CapacitanceCoss-330-PF
    Reverse Transfer CapacitanceCrss-140-PF
    Turn-on Delay Timetd(on)-1020nS
    Turn-on Rise Time

    r

    t

    -1125nS
    Turn-Off Delay Timetd(off)-3570nS
    Turn-Off Fall Time

    f

    t

    -3060nS
    Total Gate ChargeQg

    VDS=10V,ID=6A,

    -1015nC
    Gate-Source ChargeQgs-2.3-nC
    Gate-Drain ChargeQgd-1.5-nC
    Diode Forward Voltage (Note 3)VSDVGS=0V,IS=1.7A-0.751.2V
    Diode Forward Current (Note 2)

    S

    I

    --1.7A
    ParameterSymbolConditionMinTypMaxUnit
    Drain-Source Breakdown VoltageBVDSSVGS=0V ID=250μA2021-V
    Zero Gate Voltage Drain CurrentIDSSVDS=19.5V,V GS=0V--1μA
    Gate-Body Leakage CurrentIGSSVGS=±10V,VDS=0V--±100nA
    Gate Threshold VoltageVGS(th)VDS=VGS,ID=250μA0.50.71.2V

    Drain-Source On-State Resistance


    RDS(ON)

    VGS=4.5V, ID=4.5A-2127mΩ
    VGS=2.5V, ID=3.5A-2737mΩ
    Forward TransconductancegFSVDS=5V,ID=4.5A-10-S
    Input CapacitanceClss-600-PF
    Output CapacitanceCoss-330-PF
    Reverse Transfer CapacitanceCrss-140-PF
    Turn-on Delay Timetd(on)-1020nS
    Turn-on Rise Time

    r

    t

    -1125nS
    Turn-Off Delay Timetd(off)-3570nS
    Turn-Off Fall Time

    f

    t

    -3060nS
    Total Gate ChargeQg

    VDS=10V,ID=6A,

    -1015nC
    Gate-Source ChargeQgs-2.3-nC
    Gate-Drain ChargeQgd-1.5-nC
    Diode Forward Voltage (Note 3)VSDVGS=0V,IS=1.7A-0.751.2V
    Diode Forward Current (Note 2)

    S

    I

    --1.7A

    Notes:


    1. Repetitive Rating: Pulse width limited by maximum junction temperature. 2. Surface Mounted on FR4 Board, t ≤ 10 sec.

    3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%.

    4. Guaranteed by design, not subject to production


    Attention


    1, Any and all APM Microelectronics products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your APM Microelectronics representative nearest you before using any APM Microelectronics products described or contained herein in such applications.

    2, APM Microelectronics assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all APM Microelectronics products described or contained herein.

    3, Specifications of any and all APM Microelectronics products described or contained here instipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’s products or equipment.

    4, APM Microelectronics Semiconductor CO., LTD. strives to supply high quality high reliability products. However, any and all semiconductor products fail with some probability. It is possible that these probabilistic failures could give rise to accidents or events that could endanger human lives that could give rise to smoke or fire, or that could cause damage to other property. Whendesigning equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design,and structural design.

    5,In the event that any or all APM Microelectronics products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from the authorities concerned in accordance with the above law.

    6, No part of this publication may be reproduced or transmitted in any form or by any means,electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of APM Microelectronics Semiconductor CO., LTD.

    7, Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed for volume production. APM Microelectronics believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual property rights or other rights of third parties.

    8, Any and all information described or contained herein are subject to change without notice due to product/technology improvement,etc. When designing equipment, refer to the "Delivery Specification" for the APM Microelectronics product that you Intend to use.

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